Mitsubishi Electric Corporation announced today the launch of a new transfer-mold power semiconductor model in its lineup of Super-mini Dual-In-line Package Intelligent Power Modules (DIPIPMTM), embedded with Silicon Carbide Metal-Oxide-Semiconductor Field-Effect Transistors (SiC-MOSFET). It will launch on August 17.
|1)||Top class low power consumption in the home appliance market
|2)||Simplified inverter system design
|PSF15S92F6||15A/600V||August 17, 2016|